Fabrication and characterization of carbon nanotube interconnects

被引：23

作者：

Close, Gael F. ^{[1
]}

Wong, H. -S. Philip ^{[1
]}

机构：

[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA

来源：

2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 | 2007年

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/IEDM.2007.4418902

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have fabricated arrays of individual metallic multi-wall carbon nanotube interconnects. We have also collected about two hundred resistance measurements to compare four different contact metals: Al, Au, Ti and Pd. Au and Pd contacts gave the lowest resistance. To validate the concept of high-speed carbon nanotube (CNT) interconnect, we have extended our electrical measurements of individual multiwall carbon nanotubes (MWCNTs) into the radio-frequency regime up to 15 GHz. We also discuss the reasons why the conductivity of commercial MWCNTs is not yet competitive with copper.

引用

页码：203 / +

页数：2

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