Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite - I. Reaction mechanism

被引：37

作者：

Kato, M ^{[1
]}

Sato, J

Otani, H

Homma, T

Okinaka, Y

Osaka, T

Yoshioka, O

机构：

[1] Kanto Chem Co, Soka, Saitama 3400003, Japan

[2] Waseda Univ, Dept Appl Chem, Shinjuku Ku, Tokyo 1698555, Japan

[3] Waseda Univ, Adv Res Inst Sci & Engn, Shinjuku Ku, Tokyo 1698555, Japan

[4] Waseda Univ, Kagami Mem Lab Mat Sci & Technol, Shinjuku Ku, Tokyo 1698555, Japan

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2002年 / 149卷 / 03期

关键词：

D O I：

10.1149/1.1448502

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Electroless gold deposition is known to take place on Ni-based substrates even when the conventional reducing agent is excluded from the autocatalytic bath containing thiosulfate and sulfite as ligands for gold ions. It is shown in this paper that the reaction of gold deposition from this bath on electroless Ni-B substrate is not autocatalytic but, instead, proceeds primarily by the mechanism of substrate catalysis with galvanic displacement playing a secondary role. It was established that sulfite serves as the reducing agent for the substrate-catalyzed gold deposition reaction. (C) 2002 The Electrochemical Society.

引用

页码：C164 / C167

页数：4

共 6 条

[1] SUBSTRATE-CATALYZED ELECTROLESS GOLD PLATING [J].

IACOVANGELO, CD ;

ZARNOCH, KP .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (04) :983-988

[2]

INOUE T, 1995, P 45 IEEE EL COMP TE, P1095

[3]

Kato M., 1995, P AESF TECH C SURFIN, V95, P805

[4]

KRULIK GA, 1992, Patent No. 5232492

[5]

KRULIK GA, 1994, Patent No. 5318621

[6] Evaluation of substrate (Ni)-catalyzed electroless gold plating process [J].

Osaka, T ;

Misato, T ;

Sato, J ;

Akiya, H ;

Homma, T ;

Kato, M ;

Okinaka, Y ;

Yoshioka, O .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (03) :1059-1064

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