Scanning probe sharp tip formation for IC integration using MESA technique.

被引:4
作者
Grabiec, PB [1 ]
Shi, F [1 ]
Hudek, P [1 ]
Gotszalk, T [1 ]
Zabrowski, M [1 ]
Dumania, P [1 ]
Rangelow, IW [1 ]
机构
[1] UNIV GESAMTHSCH KASSEL, INST TECH PHYS, D-34109 KASSEL, GERMANY
关键词
D O I
10.1016/S0167-9317(96)00136-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel technique utilising mesa island and double-side micromachining for formation of a sharp silicon tip, integrated with a cantilever beam and electrical circuits is described in this paper. Technological process which involves bi-layer coating for effective protection of microelectronic elements during wet etching in aggressive alkaline solutions is demonstrated. The described technology enables fabrication of fully integrated AFM probes, consisting of a microtip, sensing element and microelectronic circuit.
引用
收藏
页码:329 / 332
页数:4
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