Scanning probe sharp tip formation for IC integration using MESA technique.

A novel technique utilising mesa island and double-side micromachining for formation of a sharp silicon tip, integrated with a cantilever beam and electrical circuits is described in this paper. Technological process which involves bi-layer coating for effective protection of microelectronic elements during wet etching in aggressive alkaline solutions is demonstrated. The described technology enables fabrication of fully integrated AFM probes, consisting of a microtip, sensing element and microelectronic circuit.