Microforming

被引:686
作者
Geiger, M [1 ]
Kleiner, M
Eckstein, R
Tiesler, N
Engel, U
机构
[1] Univ Erlangen Nurnberg, Chair Mfg Technol LFT, Erlangen, Germany
[2] Univ Dortmund, Chair Forming Technol LFU, Dortmund, Germany
关键词
micro metal forming; material; equipment;
D O I
10.1016/S0007-8506(07)62991-6
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Microforming is a well suited technology to manufacture very small metallic parts, in particular for mass production, as they are required in many industrial products resulting from microtechnology. Compared to other manufacturing technologies microforming features specific economical and ecological advantages. Nevertheless, there are only some singular applications known until today. This paper tries to find out the reason why, analyzing systematically the problems emerging in transferring the know-how on forming from the macro- to the microworld, Reviewing the state of the art in basic and applied research reveals that scaling effects do appear not only within the process but must be taken into account in all the other areas of the whole forming system as well, demanding finally new solutions especially for tool manufacturing and machine concepts. Recent progress, innovative ideas and new developments on these sectors represent a promising basis to exploit the inherent potential of microforming in the future.
引用
收藏
页码:445 / 462
页数:18
相关论文
共 79 条
[1]  
Altan T., 1993, ANN CIRP, V42, P347
[2]  
Andras M., 1998, QZ QUALITAT ZUVERLAS, V43, P740
[3]  
[Anonymous], ADV TECHNOLOGY PLAST
[4]  
BARCELLONA A, 1996, ANN CIRP, V45, P211
[5]  
BARK C, 1996, F M, V104, P372
[6]  
BREITENBACH F, 2000, BILDVERARBEITUNGSSYS
[7]   EVALUATION OF LUBRICATION AND FRICTION IN COLD FORGING USING A DOUBLE BACKWARD-EXTRUSION PROCESS [J].
BUSCHHAUSEN, A ;
WEINMANN, K ;
LEE, JY ;
ALTAN, T .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1992, 33 (1-2) :95-108
[8]  
Cavaliere P, 2000, METAL FORMING 2000, P405
[9]   Laser bending of an A16013/SiCp aluminium matrix composite sheet [J].
Chan, KC ;
Liang, J .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2000, 100 (1-3) :214-218
[10]   Theoretical analysis of springback in bending of integrated circuit leadframes [J].
Chan, KC ;
Wang, SH .
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1999, 91 (1-3) :111-115