Equivalent circuit model of resistive IC sensors derived with the box integration method

被引:12
作者
Maier, C [2 ]
Emmenegger, M
Taschini, S
Baltes, H
Korvink, JG
机构
[1] Univ Freiburg, Inst Microsyst Technol, D-79085 Freiburg, Germany
[2] Swiss Fed Inst Technol, Phys Elect Lab, CH-8093 Zurich, Switzerland
关键词
box integration method; equivalent circuit model; Hall effect; mechanical stress; resistive microsensors; SPICE;
D O I
10.1109/43.771181
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
We present an automatic method to produce compact equivalent circuit models of spatially inhomogeneous resistors. Local variations in space of the resistivity due to physical interactions such as magnetic fields or mechanical stress are automatically included. The equivalent circuit model is computed using symbolic algebra, such that the functional relation between the resistivity and the fields interacting with it is included in the circuit design model. Modeling is based on the discretization of the sensor geometry with a mesh of elements and vertex nodes together with the current continuity equation using the box integration method. The resistivity is described by the tensor field of electrical conductivity and depends on the physical interactions to be modeled. The element internode conductivity is mapped to a set of lumped conductances and transconductances;ces (voltage controlled current sources) between the nodes of the discretization mesh. These conductances and transconductances are translated into an equivalent circuit net list. Optionally, the electrical network representing the sensor is simplified before translation by symbolic linear algebra. Thus, equivalent circuit models consisting of many simple elements can be generated as well as models with only a few, algebraically complicated elements. The method is demonstrated using the public domain circuit simulator SPICE3 for the example of a magnetic Hall sensor, with and without the piezoresistive effect.
引用
收藏
页码:1000 / 1013
页数:14
相关论文
共 15 条
  • [1] BALTES H, 1994, SEMICONDUCTOR SENSOR, P205
  • [2] Bittle D. A., 1991, Transactions of the ASME. Journal of Electronic Packaging, V113, P203, DOI 10.1115/1.2905397
  • [3] Desoer C. A., 1969, BASIC CIRCUIT THEORY
  • [4] *ISE TCAD MAN, 1997, ISE INT SYST ENG AG, V6
  • [5] JOHNSON B, SPICE3 VERSION 3E US
  • [6] Korvink J. G., 1995, ESSDERC '95. Proceedings of the 25th European Solid State Device Research Conference, P67
  • [7] KORVINK JG, 1997, CAD MEMS 97 INT WORK
  • [8] MAIER C, P 1998 IEEE INT S CI, V6, P405
  • [9] MAYER M, P 8 MICR EUR WORKSH, P203
  • [10] MUNTER PJA, 1992, THESIS DELFT U TECHN