Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy

被引：15

作者：

Yang, JC

机构：

[1] Texas Instruments, Singapore 1233

来源：

MICROELECTRONICS AND RELIABILITY | 1996年 / 36卷 / 09期

关键词：

D O I：

10.1016/0026-2714(95)00042-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Scanning acoustic microscopy (SAM) has emerged as a powerful tool for the detection of defects in ceramic or plastic packaged integrated circuits. Al the Singapore Institute of Standards and Industrial Research, we have been using SAM to identify packaging and/or assembly related defects across a broad spectrum of integrated circuit packages. In many cases, it has been the only technology available that is capable of quickly and non-destructively determining the precise failure mode, such as delamination. Copyright (C) 1996 Elsevier Science Ltd.

引用

页码：1291 / 1295

页数：5