Power amplifiers and transmitters for RF and microwave

被引：863

作者：

Raab, FH ^{[1
]}

Asbeck, P

Cripp, S

Kenington, PB

Popovic, ZB

Pothecary, N

Sevic, JF

Sokal, NO

机构：

[1] Green Mt Radio Res, Colchester, VT 05446 USA

[2] Univ Calif San Diego, Dept Elect & Comp Engn, La Jolla, CA 92093 USA

[3] Hywave Associates, Somerset Chart TA20 3JS, England

[4] Wireless Syst Int Ltd, Bristol BS16 1EJ, Avon, England

[5] Univ Colorado, Dept Elect & Comp Engn, Boulder, CO 80309 USA

[6] IT Syst Ltd, I-0047 Marineo, Italy

[7] Tropian Inc, Cupertino, CA 95014 USA

[8] Design Automat Inc, Lexington, MA 02420 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2002年 / 50卷 / 03期

关键词：

amplifier; Chireix; class A; class B; class C; class D; class E; class F; Doherty; envelope tracking; feedback; feedforward; HF; Kahn; microwave; outphasing; power; predistortion; transmitter; UHF; VHF;

D O I：

10.1109/22.989965

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The generation of RF/microwave power is required not only in wireless communications, but also in applications such as jamming, imaging, RF heating, and miniature dc/dc converters. Each application has its own unique requirements for frequency, bandwidth, load, power, efficiency, linearity, and cost. RF power is generated by a wide variety of techniques, implementations, and active devices. Power amplifiers are incorporated into transmitters in a similarly wide variety of architectures, including linear, Kahn, envelope tracking, outphasing, and Doherty. Linearity can be improved through techniques such as feedback, feedforward, and predistortion.

引用

页码：814 / 826

页数：13

共 36 条

[1]

Anderson DR, 2001, IEEE MTT S INT MICR, P1509, DOI 10.1109/MWSYM.2001.967189

[2]

Asbeck P, 1999, MICROWAVE J, V42, P22

[3] Efficiency of chip-level versus external power combining [J].

Bryerton, EW ;

Weiss, MD ;

Popovic, Z .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999, 47 (08) :1482-1485

[4]

Conradi C. P., 1999, Engineering Solutions for the Next Millennium. 1999 IEEE Canadian Conference on Electrical and Computer Engineering (Cat. No.99TH8411), P105, DOI 10.1109/CCECE.1999.807179

[5]

Cripps SteveC., 2006, ARTECH MICR, V2nd

[6]

Davis J. F., 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192), P1113, DOI 10.1109/MWSYM.1998.705188

[7]

Grebennikov AV, 2000, IEEE MTT-S, P771, DOI 10.1109/MWSYM.2000.863295

[8]

Groe JB., 2000, ARTECH MOBIL COMMUN

[9] Microwave solid-state active devices [J].