A surface micromachined, out-of-plane anemometer

被引：6

作者：

Chen, J ^{[1
]}

Zou, J ^{[1
]}

Liu, C ^{[1
]}

机构：

[1] Univ Illinois, Microelect & Nanotechnol Lab, Urbana, IL 61801 USA

来源：

FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年

关键词：

D O I：

10.1109/MEMSYS.2002.984270

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel out-of-plane hot-wire anemometer has been developed by combining surface micromachining and efficient three-dimensional assembly. The sensing filament is made of metal instead of doped silicon. It is elevated from the substrate using an efficient three-dimensional assembly process, resulting in greater sensitivity. The overall process temperature is low (<250degreesC). Hence the process can be realized on nonsilicon, low-cost and flexible substrates. Time constant in constant-current mode is found to be below 50-mus with a wire thickness of 1000 Angstrom and 50-mum in length.

引用

页码：332 / 335

页数：4

共 7 条

[1]

Bruun H. H., 1995, HOT WIRE ANEMOMETRY

[2]

DITTMANN D, 2001, 11 INT C SOL STAT SE, P1472

[3] Three dimensional silicon triple-hot-wire anemometer based on polyimide joints [J].

Ebefors, T ;

Kalvesten, E ;

Stemme, G .

MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, :93-98

[4]

*HD MICR, 1998, PYR POL COAT EL P126

[5]

JIANG F, 1994, SOL STAT SENS ACT WO, P264

[6]

Kovacs G.T., 1998, Micromachined Transducers Sourcebook

[7] Plastic deformation magnetic assembly (PDMA) of out-of-plane microstructures:: Technology and application [J].

Zou, J ;

Chen, J ;

Liu, C ;

Schutt-Ainé, JE .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (02) :302-309

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