Remote plasma enhanced-metal organic chemical vapor deposition of zirconium oxide/silicon oxide alloy, (ZrO2)x-(SiO2)1-x (x ≤ 0.5), thin films for advanced high-K gate dielectrics

被引:15
作者
Wolfe, D [1 ]
Flock, K [1 ]
Therrien, R [1 ]
Johnson, R [1 ]
Rayner, B [1 ]
Günther, L [1 ]
Brown, N [1 ]
Claflin, B [1 ]
Lucovsky, G [1 ]
机构
[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
来源
ULTRATHIN SIO2 AND HIGH-K MATERIALS FOR ULSI GATE DIELECTRICS | 1999年 / 567卷
关键词
D O I
10.1557/PROC-567-343
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A remote plasma enhanced-metal organic chemical vapor deposition (RPE-MOCVD) process was developed for the preparation of non-crystalline (ZrO2)(x)-(SiO2)(1-x) (x less than or equal to 0.5) alloys, targeting the compound composition ZrSiO4 with k similar to 12.5. Shifts in Si LVV and Zr LMM AES energies with respect to elemental values showed that the deposited film was a fully-oxidized zirconium/silicon alloy. FTIR results were consistent with AES, and a Zr-O-Si bonding mode was identified in the spectra. The films were amorphous before and after RTA at 900 degrees C for 30 sec, as monitored via RHEED. Optical absorption measurements indicated the onset of band-to-band transitions at an energy of approximately 6 eV. Finally, C-V testing showed that the films were insulating.
引用
收藏
页码:343 / 348
页数:6
相关论文
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