共 23 条
[1]
[Anonymous], 2007, CIE PUBL
[2]
Chip scale thermal management of high brightness LED packages
[J].
FOURTH INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING,
2004, 5530
:214-223
[5]
An effective methodology for thermal characterization of electronic packaging
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2003, 26 (01)
:222-232
[8]
Corfa A., 2010, EUROSIME 2010 C BORD
[9]
EIA/JEDEC Standard, 1995, EIAJESD512 JEDEC
[10]
EIA/JEDEC Standard, 1995, EIAJESD511 JEDEC