Microstructural evolution and superplastic deformation behavior of fine grain 5083Al

The microstructural evolution during superplastic deformation of a fine grain Al-4.7 pct Mg alloy (5083Al) has been studied quantitatively. Starting from an average grain size of 7 mu m, grain growth was monitored in this alloy both under static annealing and with concurrent superplastic deformation at a high test temperature of 550 degrees C. Grain size was averaged from measurements taken in longitudinal, transverse, and thickness directions and was found to grow faster during concurrent superplastic deformation than for static annealing. A. grain growth law based on an additive nature between time-based and strain-based growth behavior was used to quantify the dynamics of concurrent grain growth. The extent of void formation during deformation was quantified as the area fraction of voids on L-S planes. This void fraction, referred to as the cavity area percent, was recorded at several levels of strain for specimens deformed at two different strain rates. A constitutive equation incorporating this grain growth data into the stress-strain rate data, determined during the early part of deformation, was generated and utilized to model the superplastic tensile behavior. This model was used in an effort to predict the stress-strain curves in uniaxial tension under constant and variable strain rate conditions. Particular attention was paid to the effects of a rapid prestrain rate on the overall superplastic response and hardening characteristics of this alloy.