Fabrication of arrays of Schottky diodes using microtransfer molding

被引：13

作者：

Hu, JM

Deng, T

Beck, RG

Westervelt, RM

Whitesides, GM ^{[1
]}

机构：

[1] Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA

[2] Harvard Univ, Dept Phys, Cambridge, MA 02138 USA

[3] Harvard Univ, Div Engn & Appl Sci, Cambridge, MA 02138 USA

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1999年 / 75卷 / 01期

基金：

美国国家科学基金会;

关键词：

soft lithography; microelectronics; microfabrication; semiconductor;

D O I：

10.1016/S0924-4247(99)00044-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the application of microtransfer molding-a representative soft lithographic technique-to the fabrication of simple Schottky diodes on silicon. The fabrication of a diode involved two microtransfer molding steps. The current-voltage responses of these diodes displayed characteristic nonlinear diode behavior. The yield of pattern transfer was 95% and the yield of functional diodes was 90%. Future improvements and potential industry application is proposed. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：65 / 69

页数：5

共 24 条

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