Through-mask anodic patterning of copper surfaces and film stability in biological media

被引：17

作者：

Dai, HX

Thai, CK

Sarikaya, M

Baneyx, F

Schwartz, DT ^{[1
]}

机构：

[1] Univ Washington, Dept Chem Engn, Seattle, WA 98195 USA

[2] Univ Washington, Dept Mat Sci & Engn, Seattle, WA 98195 USA

来源：

LANGMUIR | 2004年 / 20卷 / 08期

关键词：

D O I：

10.1021/la0350711

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

[No abstract available]

引用

页码：3483 / 3486

页数：4

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