Packaging of lenslet array on micromirrors

被引:4
作者
Tuantranont, A [1 ]
Bright, VM [1 ]
Zhang, WG [1 ]
Lee, YC [1 ]
机构
[1] Univ Colorado, Dept Mech Engn, NSF, Ctr Adv Mfg & Packaging Microwave Opt & Digital E, Boulder, CO 80309 USA
来源
OPTOELETRONIC INTEGRATED CIRCUITS AND PACKAGING III | 1999年 / 3631卷
关键词
D O I
10.1117/12.348308
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A packaging technology has been developed to integrate a lenslet array with surface micromachined segmented deformable micromirrors. 12x12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses positioned directly over the micromirror. Control of the spacing and the lateral alignment between the lenslet array and the micromirrors was important for effective fill factor. The spacing control was accomplished using a glass spacer, and the lateral alignments were achieved by the use of an interferometric microscope. Measured results of the micromirrors' optical performance demonstrated the success of the packaging technology.
引用
收藏
页码:156 / 164
页数:3
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