Contact physics of gold microcontacts for MEMS switches

被引:193
作者
Hyman, D [1 ]
Mehregany, M [1 ]
机构
[1] Case Western Reserve Univ, Dept Elect Engn & Appl Phys, Cleveland, OH 44106 USA
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 03期
关键词
contact; gold; MEMS; microcontact; microrelay; microswitch; relay; switch;
D O I
10.1109/6144.796533
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work presents a study of gold metallic contacts regarding contact resistance, heat dissipation, and surface damage in the normal-force regime of tens to hundreds of mu N, which is typical of the contact forces from microactuation, The purpose of this work is to present the micromechanical switch designer with practical information on gold contact phenomena in this force regime, as most work in micrometallic contacts has focused on contact forces greater than 1 mN, Results indicate actuation forces of several hundred mu N are required for reliable fully-metallic contacts, with resistance and current carrying ability primarily dependent on morphology, thermal management, and nm-depth material properties of the contact electrodes.
引用
收藏
页码:357 / 364
页数:8
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