Uses of electroplated aluminum for the development of microstructures and micromachining processes

被引:16
作者
Frazier, AB [1 ]
Allen, MG [1 ]
机构
[1] GEORGIA INST TECHNOL,SCH ELECT & COMP ENGN,ATLANTA,GA 30332
基金
美国国家科学基金会;
关键词
aluminum; electroplating; micromolding;
D O I
10.1109/84.585786
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, electroplated aluminum is explored as both a material for the fabrication of microstructures and use in the development of micromachining processes. A method for the fabrication of aluminum microstructures based on electrodeposition from organic solutions is presented. An extension of this process involving the use of plated aluminum structures as plating molds for subsequent electrodeposition of other materials is also discussed. Maximum structure aspect ratios of 21 : 1 have been demonstrated using this extended micromolding process. Finally, an aluminum-based process, in which the width of a metallic microstructure or the gap between metallic microstructures is achieved by controlling the plating time, is discussed. Using this process, vertical-gap aspect ratios between metallic microstructures of 25: 1 have been demonstrated. Since the width of these features is controlled by the plating time and not by photolithography, gaps between metallic microstructures or widths of electroplated features ranging from submicron to tens of microns can be easily achieved using this process. [150]
引用
收藏
页码:91 / 98
页数:8
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