Evolution of mound morphology in reversible homoepitaxy on Cu(100)

被引：155

作者：

Zuo, JK ^{[1
]}

Wendelken, JF ^{[1
]}

机构：

[1] OAK RIDGE NATL LAB, DIV SOLID STATE, OAK RIDGE, TN 37831 USA

来源：

PHYSICAL REVIEW LETTERS | 1997年 / 78卷 / 14期

关键词：

D O I：

10.1103/PhysRevLett.78.2791

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

Evolution of mound morphology in reversible homoepitaxy on Cu(100) was studied via spot-profile-analysis (SPA) LEED and scanning tunneling microscopy. The mound separation shows coarsening vs growth time with L(t) similar to t(1/4), in support of theory based on capillarity between mounds. The growth ultimately reaches a steady state characterized by a selected mound angle of similar to 5.6 degrees. We suggest that this results from a downhill current driven by step edge line tension in balance with an uphill current due to the Schwoebel barrier effect. Also, we have clarified the interpretation for the evolution of the SPA-LEED profile from a ring structure to a single time-invariant peak.

引用

页码：2791 / 2794

页数：4

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