Device grade microcrystalline silicon owing to reduced oxygen contamination

被引:137
作者
Torres, P
Meier, J
Fluckiger, R
Kroll, U
Selvan, JAA
Keppner, H
Shah, A
Littelwood, SD
Kelly, IE
Giannoules, P
机构
[1] EVANS EUROPA,UXBRIDGE UB8 3PH,MIDDX,ENGLAND
[2] SAES GETTERS GMBH,D-50937 COLOGNE 41,GERMANY
关键词
D O I
10.1063/1.117440
中图分类号
O59 [应用物理学];
学科分类号
摘要
As-deposited undoped microcrystalline silicon (mu c-Si:H) has in general a pronounced n-type behavior, Such a material is therefore often not appropriate for use in devices, such as p-i-n diodes, as an active, absorbing i layer or as channel material for thin-film transistors. In recent work, on p-i-n solar cells, this disturbing n-type character had been successfully compensated by the ''microdoping'' technique. In the present letter, it is shown that this n-type behavior is mainly linked to oxygen impurities; therefore, one can replace the technologically delicate microdoping technique by a purification method, that is much easier to handle. This results in a reduction of oxygen impurities by two orders of magnitude; it has, furthermore a pronounced impact on the electrical properties of mu c-Si:H films and on device performance, as well. Additionally, these results prove that the unwanted donor-like states within mu c-Si:H are mainly due to extrinsic impurities and not to structural native defects. (C) 1996 American Institute of Physics.
引用
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页码:1373 / 1375
页数:3
相关论文
共 16 条
  • [1] BECK N, IN PRESS J NONCRYST
  • [2] FINGER F, 1994, APPL PHYS LETT, V65, P2558
  • [3] ELECTRICAL-PROPERTIES AND DEGRADATION KINETICS OF COMPENSATED HYDROGENATED MICROCRYSTALLINE SILICON DEPOSITED BY VERY HIGH-FREQUENCY-GLOW DISCHARGE
    FLUCKIGER, R
    MEIER, J
    GOETZ, M
    SHAH, A
    [J]. JOURNAL OF APPLIED PHYSICS, 1995, 77 (02) : 712 - 716
  • [4] FLUCKIGER R, 1993, IEEE PHOT SPEC CONF, P839, DOI 10.1109/PVSC.1993.347112
  • [5] Fluckiger R, 1995, THESIS U NEUCHATEL THESIS U NEUCHATEL
  • [6] Keppner H., 1995, SOLID STATE PHENOM, V44-46, P97
  • [7] KROLL U, 1995, J VAC SCI TECHNOL A, V13, P2724
  • [8] KROLL U, 1995, MATER RES SOC S P, V377, P39
  • [9] LUCOVSKY G, 1993, MAT RES S C, V283, P443
  • [10] MEIER J, 1994, IEEE PHOT SPEC CONF, P409, DOI 10.1109/WCPEC.1994.519985