Stiction reduction processes for surface micromachines

被引:52
作者
Maboudian, Roya [1 ]
Howe, Roger T. [2 ]
机构
[1] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Dept Chem Engn, Berkeley, CA 94720 USA
[2] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
基金
美国国家科学基金会;
关键词
surface micromachining; MEMS; stiction; adhesion;
D O I
10.1023/A:1019185206471
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
We present a review of surface micromachining technology with an emphasis on polycrystalline silicon (polysilicon) microstructures. The problems of release-related and in-use stiction are then introduced along with a brief review of various approaches developed for reducing them. These include surface roughening and chemical modification of the silicon surfaces. The constraints that post-release back-end processes such as assembly and packaging place on surface treatments are described in general. Finally, we briefly outline some of the important scientific and technological issues that remain to be clarified in stiction phenomena in micromechanical structures.
引用
收藏
页码:215 / 221
页数:7
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