Analytical forced convection modeling of plate fin heat sinks

被引：103

作者：

Teertstra, P ^{[1
]}

Yovanovich, MM ^{[1
]}

Culham, JR ^{[1
]}

Lemczyk, T ^{[1
]}

机构：

[1] Univ Waterloo, Dept Mech Engn, Microelect Heat Transfer Lab, Waterloo, ON N2L 3G1, Canada

来源：

FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 1999年

关键词：

D O I：

10.1109/STHERM.1999.762426

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An analytical model is presented that predicts the average heat transfer rate for forced convection, air cooled, plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, 0.1 < Re-b* < 100, and accurately predicts the experimental results to within an RMS difference of 2.1%.

引用

页码：34 / 41

页数：8

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