Ultrasonic images interpretation improvement for microassembling technologies characterisation

被引:16
作者
Bechou, L
Ousten, Y
Tregon, B
Marc, F
Danto, Y
Even, R
Kertesz, P
机构
[1] DIRECT GEN ARMEMENT,F-92131 ISSY MOULINEAUX,FRANCE
[2] DASSAULT ELECT,F-92214 ST CLOUD,FRANCE
来源
MICROELECTRONICS AND RELIABILITY | 1997年 / 37卷 / 10-11期
关键词
D O I
10.1016/S0026-2714(97)00160-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper deals with two techniques for improvement of ultrasonic images interpretation based on image and digital signal processing. The first technique concerns image processing. We propose an analytical model to evaluate the effective Point Spread Function (PSF) of a reflection scanning ultrasonic system. We present the great interest of the knowledge of the PSF for deconvolution of ultrasonic images based on Lucy-Richardson algorithm. With this technique, lateral resolution is strongly improved and real dimensions of an object can be reached that is necessary to improve the understanding and interpretation of an image The second technique concerns ultrasonic images showing different nature of defects. A better understanding of these images can be realized by means of time of flight detection. This technique concerns Time-Frequency (TF) analysis to determine nature and depth of defects with accuracy. Two applications of microassembling die-attach characterisation are presented using these methods. (C) 1997 Elsevier Science Ltd.
引用
收藏
页码:1787 / 1790
页数:4
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