High resolution assembly of patterned metal oxide thin films via microtransfer molding and electrochemical deposition techniques

被引：30

作者：

Stevenson, KJ

Hurtt, GJ

Hupp, JT

机构：

[1] Northwestern Univ, Dept Chem, Evanston, IL 60208 USA

[2] Northwestern Univ, Ctr Mat Res, Evanston, IL 60208 USA

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 1999年 / 2卷 / 04期

关键词：

D O I：

10.1149/1.1390774

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A versatile method for preparing patterned thin films of metal oxides (MoO3 and WO3) and related materials on transparent, conductive indium-tin oxide (ITO) glass platforms is reported. Micrometer-sized features are formed by microtransfer molding of an optically transparent, thermally curable epoxy on ITO substrates followed by cathodic electrodeposition of the metal oxide from aqueous metal-hydrogen peroxide solutions. Atomic force microscopy was used to characterize the resulting microstructure and to examine effects of sintering on the patterned thin films. (C) 1999 The Electrochemical Society. S1099-0062(98)09-085-3. All rights reserved.

引用

页码：175 / 177

页数：3

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