Analysis of the distribution of thermal residual stresses in bonded composite repair of metallic aircraft structures

被引：28

作者：

Aminallah, L. ^{[2
,3
]}

Achour, T. ^{[1
]}

Bouiadjra, B. Bachir ^{[1
]}

Serier, B. ^{[1
]}

Amrouche, A. ^{[3
]}

Feaugas, X. ^{[4
]}

Benssediq, N. ^{[3
]}

机构：

[1] Univ Djillali Liabes Sidi Bel Abbes, Dept Mech Engn, LMPM, Sidi Bel Abbes 22000, Algeria

[2] Univ Mascara, Dept Mech Engn, Mascara 29000, Algeria

[3] Univ Lille 1, Lab Mecan Lille, CNRS, UMR 8107, F-59650 Villeneuve Dascq, France

[4] Univ La Rochelle, LEMMA, F-17042 La Rochelle 1, France

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2009年 / 46卷 / 04期

关键词：

Bonded composite repair; Thermal stresses; Stress intensity factor; Adhesive; Finite element method;

D O I：

10.1016/j.commatsci.2009.05.008

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, the distribution of the thermal residual stresses due to the adhesive curing in bonded composite repair is analysed using the finite element method. The computation of these stresses comprises all components of the structures: cracked plate, composite patch and adhesive layer. In addition, the influence of these residual stresses on the repair performance is highlighted by analysing their effect on the stress intensity factor at the crack tip. The obtained results show that the normal thermal stresses in the plate and the patch are important and the shear stresses are less significant. The level of the adhesive thermal stresses is relatively high. The presence of the thermal stresses increases the stress intensity factor at the crack tip, what reduce the repair performance. (C) 2009 Published by Elsevier B.V.

引用

页码：1023 / 1027

页数：5

共 9 条

[1]

ALBAT AM, 1993, THESIS U BRIT COLUMB

[2]

Baker A.A., 2002, ADV BONDED COMPOSITE

[3] Residual stress development during the composite patch bonding process: measurement and modeling [J].

Djokic, D ;

Johnston, A ;

Rogers, A ;

Lee-Sullivan, P ;

Mrad, N .

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2002, 33 (02) :277-288

[4]

Henshell R. D., 1975, International Journal for Numerical Methods in Engineering, V9, P495, DOI 10.1002/nme.1620090302

[5] PARAMETRIC STUDY OF FATIGUE CRACK GROWTH-BEHAVIOR IN ADHESIVELY BONDED METALLIC STRUCTURES [J].

RATWANI, MM .

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 1978, 100 (01) :46-51

[6] Analysis of cracked aluminum plates repaired with bonded composite patches [J].

Sun, CT ;

Klug, J ;

Arendt, C .

AIAA JOURNAL, 1996, 34 (02) :369-374

[7]

Swenson D., 1998, FRANC2DL CRACK PROPA

[8] Thermal stresses in a plate with a circular reinforcement [J].

Wang, CH ;

Rose, LRF ;

Callinan, R ;

Baker, AA .

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2000, 37 (33) :4577-4599

[9] Thermal Residual Stresses in Single-sided Bonded Composite Patching [J].

Wang, Zun ;

Xiao, Jiayu ;

Jiang, Dazhi ;

Zeng, Jingcheng ;

Yang, Fubiao .

JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, 2009, 28 (05) :587-599

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