Determining hardness of thin films in elastically mismatched film-on-substrate systems using nanoindentation

被引：118

作者：

Han, SM ^{[1
]}

Saha, R ^{[1
]}

Nix, WD ^{[1
]}

机构：

[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA

来源：

ACTA MATERIALIA | 2006年 / 54卷 / 06期

关键词：

nanoindentation; thin films; hardness; substrate effects; contact stiffness;

D O I：

10.1016/j.actamat.2005.11.026

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Nanoindentation has developed as a practical tool for determining the mechanical properties of thin films. In this paper, we develop a method for determining the hardness of thin films on substrates based on measurements of the contact stiffness vs. depth of indentation and prior knowledge of the elastic properties of the film and substrate. The method utilizes an analysis of contact stiffness vs. contact area for purely elastic indentation to correct for the effects of surface roughness and pile-up/sink-in on the contact area during elastic-plastic indentation of elastically mismatched film/substrate systems. We find the hardness to be essentially depth independent for indentation depths approaching the thickness of the film for several thin film/substrate systems. This new technique is described in detail and is applied to the nanoindentation of compliant films on stiff substrates (Al/Si and Al/sapphire) and stiff films on compliant substrates (W/Si and W/glass). (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1571 / 1581

页数：11

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