A novel circuit fabrication technique using offset lithography

被引：25

作者：

Ramsey, BJ

Evans, PSA

Harrison, D

机构：

[1] Department of Design, Brunel University, Runnymede Campus, Egham, Surrey

来源：

JOURNAL OF ELECTRONICS MANUFACTURING | 1997年 / 7卷 / 01期

关键词：

film circuits; printing; circuit boards; conductive inks; offset lithography; microwave structures; printed films;

D O I：

10.1142/S0960313197000075

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper reports the progress in the development of a novel fabrication technique for thin-film electronic circuit boards. The application of this work is in substitutes for resin-laminate circuit boards fabricated by photo-resist and etching processes. Circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Whilst developed primarily for low cost applications, Conductive Lithographic Films (CLFs) have now been successfully demonstrated in a range of telephone plant, microprocessor and microwave stripline applications.

引用

页码：63 / 67

页数：5