Chemical effects of methyl and methyl ester groups on the nucleation and growth of vapor-deposited aluminum films

被引:134
作者
Hooper, A
Fisher, GL
Konstadinidis, K
Jung, D
Nguyen, H
Opila, R
Collins, RW
Winograd, N
Allara, DL
机构
[1] Lucent Technol, Bell Labs, Murray Hill, NJ 07974 USA
[2] Penn State Univ, Dept Chem, University Pk, PA 16802 USA
[3] Penn State Univ, Dept Phys, University Pk, PA 16802 USA
关键词
D O I
10.1021/ja9835234
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The interaction of vapor-deposited Al atoms with self-assembled monolayers (SAMs) of HS(CH2)(15)CH3 and HS(CH2)(15)CO2CH3 chemisorbed at Au{111} surfaces was studied using X-ray photoelectron spectroscopy, infrared spectroscopy, time-of-flight secondary ion mass spectrometry, and spectroscopic ellipsometry. For the CH3-terminated SAM, no reaction with C-H or C-C bonds was observed. For total Al doses up to similar to 12 atoms/nm(2), penetration to the Au-S interface occurs with no disruption of the average chain conformation and tilt, indicating formation of a highly uniform similar to 1:1 Al adlayer on the Au. Subsequently, penetration ceases and a metallic overlayer begins to form at the SAM-vacuum interface. These results are explained in terms of an initial dynamic hopping of the -S headgroups on the An lattice, which opens transient diffusion channels to the Au-S interface, and the closing of these channels upon completion of the adlayer. In contrast, Al atom interactions with the CO2CH3-terminated SAM are restricted to the vacuum interface, where in the initial stages discrete organometallic products form via reaction with the CO2CH3 group. First, a I:1 complex forms with a reduced C=O bond and an intact CH3 moiety. Further exposure leads to the additional reaction of about four Al atoms per ester, after which a metallic overlayer nucleates in the form of clusters. After the growth progresses to similar to 30 Angstrom, the clusters coalesce into a uniform metallic film. These results illustrate the extraordinary degree of control that organic substrates can exert during the course of metal film formation.
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页码:8052 / 8064
页数:13
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