Low-power resonant laser ablation of copper

被引：20

作者：

Gill, CG ^{[1
]}

Allen, TM ^{[1
]}

Anderson, JE ^{[1
]}

Taylor, TN ^{[1
]}

Kelly, PB ^{[1
]}

Nogar, NS ^{[1
]}

机构：

[1] UNIV CALIF DAVIS,DEPT CHEM,DAVIS,CA 95616

来源：

APPLIED OPTICS | 1996年 / 35卷 / 12期

关键词：

D O I：

10.1364/AO.35.002069

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We emphasize two points: (1) the properties and mechanisms of very low-fluence ablation of copper surfaces and (2) the sensitivity and selectivity of resonant laser ablation (RLA). We present results for ablation of bulk copper and copper thin films; spot-size effects; the effects of surface-sample preparation and beam polarization; and an accurate measurement of material removal rates, typically less than or equal to 10(-3) Angstrom at 35 mJ/cm(2). Velocity distributions were Maxwellian, with peak velocities approximate to 1-2 x 10(5) cm/s. In addition, we discuss the production of diffractionlike surface features, and the probable participation of nonthermal desorption mechanisms. RLA is shown to be a sensitive and useful diagnostic for studies of low-fluence laser-material interactions. (C) 1996 Optical Society of America

引用

页码：2069 / 2082

页数：14

共 62 条

[1] DEPTH PROFILING OF COPPER THIN-FILMS BY RESONANT LASER-ABLATION [J].