Determination of micromechanical properties of thin films by beam bending measurements with an atomic force microscope

被引:49
作者
Serre, C
Pérez-Rodríguez, A
Morante, JR
Gorostiza, P
Esteve, J
机构
[1] Univ Barcelona, CSIC, Unitat Associada CNM, Dept Elect,EME, Barcelona, Spain
[2] Univ Barcelona, Serv Cientif Tecn, Barcelona 08028, Spain
[3] CSIC, Ctr Nacl Microelect, Bellaterra 08193, Spain
关键词
mechanical properties; micromechanical devices; thin films; polysilicon; silicon carbide; atomic force microscope; Young's modulus;
D O I
10.1016/S0924-4247(98)00347-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micromechanical measurements have been performed with a beam bending based technique using an atomic force microscope (AFM). This technique combines a very high load resolution with a nanometric precision in the measurement of the cantilever deflection. It has been applied to the determination of the Young's modulus of different micromachined structures as polysilicon and beta-SiC cantilever beams. This has required the previous calibration of the technique. The different characteristics of the analysed structures determined the need to use different AFM probes, being the optimum measuring condition achieved when both the probe and the beam have similar force constants. The results obtained show the ability of the proposed technique for the micromechanical assessment of miniaturised structures, which is required for development and optimisation of advanced micromachining technologies. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:134 / 138
页数:5
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