Implementation and validation of a new thermal model for analysis, design, and characterization of multichip power electronics devices

被引：6

作者：

Profumo, F ^{[1
]}

Tenconi, A

Facelli, S

Passerini, B

机构：

[1] Politecn Torino, Dipartimento Ingn Elettr, I-10129 Turin, Italy

[2] Int Rectifier Corp Italiana, Venaria, Italy

来源：

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS | 1999年 / 35卷 / 03期

关键词：

electrothermal model; multichip; power electronics; simulation; thermal impedance;

D O I：

10.1109/28.767018

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

This paper presents a new electrothermal model for the analysis, design, and characterization of multichip power electronics devices. This model allows the junction temperature calculation for devices in which several chips are thermally interacting. In the beginning of the paper, the thermal and electrical parameters and submodels used for the simulation are described. Thus, the calculation procedure that allows us to determine the chip's temperature is illustrated. In the latter part of the paper, some results related to a practical application for which the model has been used and the experimental validation of the model are presented.

引用

页码：663 / 669

页数：7

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[2]

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[3]

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