Influence of fluorine on the simulation of the transient enhanced diffusion of 15 keV BF+2 ion implantation into silicon

被引:8
作者
Dusch, A
Marcon, J [1 ]
Masmoudi, K
Ketata, K
Olivié, F
Benhzora, M
Ketata, M
机构
[1] Univ Rouen, IUT, UPRES EA 2654, LEMI, F-76821 Mont St Aignan, France
[2] CNRS, LAAS, F-31077 Toulouse, France
关键词
boron; fluorine; transient enhanced diffusion; simulation; amorphization; cluster;
D O I
10.1016/S0168-583X(01)00875-8
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
We have simulated the transient enhanced diffusion (TED) of boron fluoride (BF2+) implanted in crystalline and germanium amorphized silicon. Based on recently published models, the effect of fluorine on boron diffusion in silicon has been introduced and a modelling has been suggested. In order to simulate the boron experimental profiles, we have assumed that fluorine forms clusters involving interstitial boron which reduces the junction depth. Experimental results indicate that fluorine behaviour depends on amorphization energy. Moreover, even no germanium preamorphization is performed, silicon is still amorphized by fluorine species. Hence, BF2+ implantation leads to an amorphous/crystalline (a/c) interface near the surface. An improvement of published models is suggested taking into account fluorine effects. The simulations satisfactory reproduce the SIMS experimental profiles for a large scale of experimental conditions. © 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:360 / 365
页数:6
相关论文
共 25 条
[1]  
BOUSSAID F, 1999, THESIS I NATL SCI AP
[2]   Nucleation, growth and dissolution of extended defects in implanted Si: impact on dopant diffusion [J].
Claverie, A ;
Giles, LF ;
Omri, M ;
de Mauduit, B ;
Ben Assayag, G ;
Mathiot, D .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1999, 147 (1-4) :1-12
[3]   Effect of fluorine on the diffusion of boron in ion implanted Si [J].
Downey, DF ;
Chow, JW ;
Ishida, E ;
Jones, KS .
APPLIED PHYSICS LETTERS, 1998, 73 (09) :1263-1265
[4]   Optimization of RTA parameters to produce ultra-shallow, highly activated B+, BF2+, and As+ ion implanted junctions [J].
Downey, DF ;
Marcus, SD ;
Chow, JW .
JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (12) :1296-1314
[5]   Dose-rate effects on the formation of ultra-shallow junctions with low-energy B+ and BF2+ ion implants [J].
Downey, DF ;
Osburn, CM ;
Cummings, JJ ;
Daryanani, S ;
Falk, SW .
THIN SOLID FILMS, 1997, 308 :562-569
[6]   Modeling of the transient enhanced diffusion of boron implanted into preamorphized silicon:: the case of BF2+ implantation [J].
Dusch, A ;
Marcon, J ;
Masmoudi, K ;
Olivié, F ;
Benzohra, M ;
Ketata, K ;
Ketata, M .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2001, 80 (1-3) :65-67
[7]   POINT-DEFECT CHARGE-STATE EFFECTS ON TRANSIENT DIFFUSION OF DOPANTS IN SI [J].
FAIR, RB .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (02) :667-671
[8]   EFFECT OF FLUORINE ON THE DIFFUSION OF THROUGH-OXIDE IMPLANTED BORON IN SILICON [J].
FAN, D ;
PARKS, JM ;
JACCODINE, RJ .
APPLIED PHYSICS LETTERS, 1991, 59 (10) :1212-1214
[9]   THE EFFECT OF FLUORINE ON THE REDISTRIBUTION OF BORON IN ION-IMPLANTED SILICON [J].
KRASNOBAEV, LY ;
OMELYANOVSKAYA, NM ;
MAKAROV, VV .
JOURNAL OF APPLIED PHYSICS, 1993, 74 (10) :6020-6022
[10]   RTP requirements to yield uniform and repeatable ultra-shallow junctions with low energy boron and BF2 ion implants [J].
Marcus, S ;
Lerch, W ;
Downey, DF ;
Todorov, S ;
Chow, C .
JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (12) :1291-1295