The effect of oxygen partial pressure during heat treatment on the microstructure of dip-coated Bi-2212/Ag and Ag alloy tapes

被引：13

作者：

Fujii, H ^{[1
]}

Kumakura, H ^{[1
]}

Kitaguchi, H ^{[1
]}

Togano, K ^{[1
]}

Zhang, W ^{[1
]}

Feng, Y ^{[1
]}

Hellstrom, EE ^{[1
]}

机构：

[1] UNIV WISCONSIN,CTR APPL SUPERCONDUCT,MADISON,WI 53706

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1997年 / 7卷 / 02期

关键词：

D O I：

10.1109/77.620908

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The evolution of the microstructure during heat treatment was investigated for dip-coated Bi2Sr2CaCu2Oy(Bi-2212)/Ag and Ag alloy tapes as a function of temperature and oxygen partial pressure(P-O2=0.01, 0,21 and 1 atm) using quenched and fully-processed tapes, The microstructures were essentially the same for Bi-2212 on pure Ag and on the Ag alloy, Although the melting temperature of Bi-2212 increased with increasing P-O2, the solidification temperature(T-sol) of Bi-2212 for P-O2=0.21 atm was higher than that for P-O2=1 atm, The volume fraction and grain alignment of Bi-2212 processed in P-O2=0.01 atm was smaller than in tapes processed in 0.21 and 1 atm, which were quite similar. HR-TEM studies on grain boundaries and AC susceptibility measurements suggest that the higher critical current density(J(c)) for tapes processed in P-O2=1 atm than that for 0.21 atm is due to improved coupling of the grains.

引用

页码：1707 / 1710

页数：4

共 12 条

[1] MODEL FOR THE LOW-TEMPERATURE TRANSPORT OF BI-BASED HIGH-TEMPERATURE SUPERCONDUCTING TAPES [J].