Thermal and mechanical evaluations of a cost-effective Plastic Ball Grid Array package

被引：13

作者：

Lau, JH

Chen, KL

机构：

[1] Express Packaging Systems Inc., Palo Alto, CA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 1997年 / 119卷 / 03期

关键词：

D O I：

10.1115/1.2792236

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

引用

页码：208 / 212

页数：5