Development of new Pb-free solder alloy of Sn-Ag-Bi system

被引：21

作者：

Habu, K ^{[1
]}

Takeda, N ^{[1
]}

Watanabe, H ^{[1
]}

Ooki, H ^{[1
]}

Abe, J ^{[1
]}

Saito, T ^{[1
]}

Taniguchi, Y ^{[1
]}

Takayama, K ^{[1
]}

机构：

[1] Sony Corp, Ctr Environm Technol, Res Ctr, Hodogaya Ku, Yokohama, Kanagawa 2400031, Japan

来源：

PROCEEDINGS OF THE 1999 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT, ISEE - 1999 | 1999年

关键词：

D O I：

10.1109/ISEE.1999.765841

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

New solder alloys are now being developed to fmd Pb-free alternatives to conventional lead -based solder for environmental reasons. We have developed a novel lead-free solder made up of tin, silver, bismuth, copper, and germanium with the composition Sn-2.0Ag-4.0Bi-0.5Cu0.1Ge. The small amount of germanium drastically improves the solderability and the reliability of the Sn-Ag-Bi system. The new solder is usable in conventional soldering equipment.

引用

页码：21 / 24

页数：4