Characterization of hot deformation behavior of anew near beta titanium alloy: Ti-7333

被引:155
作者
Fan, J. K. [1 ]
Kou, H. C. [1 ]
Lai, M. J. [1 ]
Tang, B. [1 ]
Chang, H. [1 ]
Li, J. S. [1 ]
机构
[1] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
关键词
Titanium alloy; Hot deformation; Constitutive equation; Processing map; Dynamic recrystallization; MICROSTRUCTURAL EVOLUTION; FLOW BEHAVIOR; PROCESSING MAPS; WORKING; TI-10V-2FE-3AL; MECHANISMS; TI-6AL-4V;
D O I
10.1016/j.matdes.2013.02.044
中图分类号
T [工业技术];
学科分类号
120111 [工业工程];
摘要
The hot deformation behavior of Ti-7333 titanium alloy in the temperature range of 770-970 degrees C and strain rate range of 10(-3)-10 s(-1) has been investigated by hot compressive testing on the Gleeble-3800 thermal and mechanical simulator. The results show that the maximum stress decreases with decreasing strain rate and increasing temperature. The flow curves characteristic under different deformation parameters show obvious different. And discontinuous yielding occurs to the alloy at a higher strain rate for all the experimental temperatures. The flow behaviors are described by the hyperbolic sine constitutive equation and the hot deformation activation energies in (alpha + beta) and beta region are calculated as 333.74 kJ/mol and 213.83 kJ/mol, respectively. By comparing with similar alloys such as Ti-5553 and Ti-1023, the new near beta titanium alloy Ti-7333 exhibits weaker deformation resistance. Based on the dynamic materials model, the processing map is generated, which shows that there are three domains of peak efficiency. The highest peak efficiency of power dissipation of 65% occurs at about 855 degrees C/0.001 s(-1). Dynamic recovery and dynamic recrystallization occur during hot compression deformation and the degree of dynamic recrystallization is dependent sensitively on deformation temperature and strain rate. In the instability regimes, the material exhibits flow instabilities manifested in the form of flow localizations. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码:945 / 952
页数:8
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