Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps

被引：47

作者：

Sasaki, JI ^{[1
]}

Itoh, M

Tamanuki, T

Hatakeyama, H

Kitamura, S

Shimoda, T

Kato, T

机构：

[1] NEC Corp Ltd, Networking Res Labs, Tsukuba, Ibaraki 3058501, Japan

[2] Optobahn Corp, Torrance, CA 90502 USA

[3] NEC Corp Ltd, Photon & Wireless Devices Res Labs, Tsukuba, Ibaraki 3058501, Japan

[4] NEC Compound Semicond Devices Ltd, Otsu, Shiga 5200833, Japan

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2001年 / 24卷 / 04期

关键词：

D O I：

10.1109/6040.982846

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A novel three-dimensional high precision self-aligned assembly using stripe-type Au-Sn solder bumps and a micro-press solder bump formation method was developed. This assembly was shown to be useful for building hybrid-integrated multichannel optical network components.

引用

页码：569 / 575

页数：7

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