A kinetic study of the cementation of copper from sulphate solutions onto a rotating aluminum disc

被引：51

作者：

Dönmez, B ^{[1
]}

Sevim, F ^{[1
]}

Saraç, H ^{[1
]}

机构：

[1] Ataturk Univ, Fac Engn, Dept Chem Engn, TR-25240 Erzurum, Turkey

来源：

HYDROMETALLURGY | 1999年 / 53卷 / 02期

关键词：

copper; sulphate solutions; rotating aluminum disc;

D O I：

10.1016/S0304-386X(99)00042-0

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The cementation kinetics of copper deposition from sulphate solutions onto aluminum was studied using a rotating disc electrode system. The effect of temperature, Cu++ ion concentration, rotational speed of the aluminum disc and pH was investigated. The activation energy was found to be 14.1 kJ mol(-1), confirming that the rate of reaction was controlled by diffusion. (C) 1999 Elsevier Science B.V. All rights reserved.

引用

页码：145 / 154

页数：10

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