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Moire interferometry/termovision method for electronic packages testing
被引：2
作者：
Salbut, L
Kujawinska, M
机构：
来源：
OPTICAL INSPECTION AND MICROMEASUREMENTS II
|
1997年
/
3098卷
关键词：
optical methods of testing;
moire (grating) interferometry;
termovision;
electronic packaging;
D O I：
10.1117/12.281157
中图分类号：
O43 [光学];
学科分类号：
070207 ;
0803 ;
摘要：
The method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.
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页码：10 / 17
页数：8
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