Substrate bonding techniques for CMOS processed wafers

被引：17

作者：

vanderGroen, S

Rosmeulen, M

Baert, K

Jansen, P

Deferm, L

机构：

[1] IMEC, Kapeldreef 75

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1997年 / 7卷 / 03期

关键词：

D O I：

10.1088/0960-1317/7/3/006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate anti subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer.

引用

页码：108 / 110

页数：3