Front and rear silicon-nitride-passivated multicrystalline silicon solar cells with an efficiency of 18.1%

被引:12
作者
Mittelstädt, L
Dauwe, S
Metz, A
Hezel, R
Hässler, C
机构
[1] Inst Solarenergieforsch Hameln Emmerthal ISFH, D-31860 Emmerthal, Germany
[2] Bayer AG, Cent Res Dept, D-47829 Krefeld, Germany
来源
PROGRESS IN PHOTOVOLTAICS | 2002年 / 10卷 / 01期
关键词
Crystalline materials - Low temperature effects - Passivation - Photolithography - Plasma enhanced chemical vapor deposition - Silicon nitride;
D O I
10.1002/pip.423
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
A solar cell process designed to utilise low-temperature plasma-enhanced chemical vapour deposited (PECVD) silicon nitride (SiNx) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (me-Si) solar cells. Despite the simple photolithography-free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 x 2 cm(2)) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiNx film in combination with a local aluminium back-surface field (LBSF). Thus, it is demonstrated that low-temperature PECVD SiNx films are well suited to achieve excellent rear surface passivation on mc-Si. Copyright (C) 2002 John Wiley Sons, Ltd.
引用
收藏
页码:35 / 39
页数:5
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