Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

被引：73

作者：

Wong, CP ^{[1
]}

Bollampally, RS ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 01期

关键词：

composites; encapsulants; packaging; polymer; thermal conductivity;

D O I：

10.1109/6040.746543

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal management plays a very vital role in the packaging of high performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly influence the package heat dissipation. Unlike molding compounds, the filler loading in these encapsulants is restrained, This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. A comparative, study on the effect of different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented.

引用

页码：54 / 59

页数：6

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