Automatic transfer of parametric FEM models into CAD-layout formats for top-down design of microsystems

被引：3

作者：

Lang, M

David, D

Glesner, M

机构：

来源：

EUROPEAN DESIGN & TEST CONFERENCE - ED&TC 97, PROCEEDINGS | 1997年

关键词：

D O I：

10.1109/EDTC.1997.582359

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A tool for the transfer of solid models used for FEM simulations into different layout formats used by CAD environments is presented AII necessary layers for the fabrication of microcomponents and -systems in a given extended commercial CMOS process are generated automatically by this tool. Starting with an acceleration sensor the use of this translator for an application in the top-down design of microsystems with parametric components is described.

引用

页码：200 / 204

页数：5