Direct writing in three dimensions

被引：362

作者：

Lewis, Jennifer A. ^{[1
]}

Gratson, Gregory M. ^{[1
]}

机构：

[1] Univ Illinois, Frederick Seitz Mat Res Lab, Dept Mat Sci & Engn, Chem & Biomol Engn Dept, Urbana, IL 61801 USA

来源：

MATERIALS TODAY | 2004年 / 7卷 / 7-8期

基金：

美国国家科学基金会;

关键词：

Drug-delivery devices - Microfluidic networks - Photonic band gap materials - Tissue engineering scaffolds;

D O I：

10.1016/S1369-7021(04)00344-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The ability to pattern materials in three dimensions is critical for several emerging technologies, including photonics, microfluidics, microelectromechanical systems, and biomaterials. Direct-write assembly allows one to design and rapidly fabricate materials in complex three-dimensional shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in ink and laser writing techniques are reviewed with an emphasis on the push toward finer feature sizes. Opportunities and challenges associated with direct-write assembly are also highlighted.

引用

页码：32 / 39

页数：8

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