Efficient SPICE-compatible electromagnetic model of arbitrarily shaped integrated passive structure

被引：5

作者：

Milsom, RF ^{[1
]}

机构：

[1] Philips Res Labs, Redhill RH1 5HA, Surrey, England

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1999年 / 47卷 / 07期

关键词：

boundary-element method; electromagnetic layout simulation; equivalent-circuit model; passive integration;

D O I：

10.1109/22.775435

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A numerically efficient SPICE-compatible electromagnetic model of an arbitrarily shaped integrated passive structure is presented. it is suitable for modeling structures with electrically small, but geometrically complex features. The original model, developed for printed circuit board layout simulation, is shown to be inadequate for integrated circuits, and also not directly usable for time-domain analysis. Here, it is adapted for structures fabricated in a silicon passive-integration process, and then extended to allow nonlinear time-domain analysis of active multichip modules that employ this technology as the substrate. Special emphasis is placed on characterizing losses. Comparison with measurement shows that the model is accurate.

引用

页码：1033 / 1044

页数：12

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