SILC as a measure of trap generation and predictor of TBD in ultrathin oxides

被引:43
作者
Alam, MA [1 ]
机构
[1] Agere Syst, Murray Hill, NJ 07974 USA
关键词
MOS devices; reliability modeling; semiconductor device modeling; semiconductor device reliability; stress-induced leakage current (SILC);
D O I
10.1109/16.981211
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The theoretical basis of stress-induced leakage current (SILC) as a measure of bulk trap density within thin oxide films is explored. Contrary to popular belief, this measure is neither absolute, nor do most papers in the literature sufficiently specify the measurement conditions to make their comparison meaningful. We also explore the relationship between SILC generation rate and the time-to-breakdown, and show that only a very specific definition of SILC generation can capture the voltage dependence of the time-to-breakdown.
引用
收藏
页码:226 / 231
页数:6
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