Diagnostics of fluorocarbon radicals in a large-area permanent magnet electron cyclotron resonance etching plasma

被引:16
作者
Den, S
Kuno, T
Ito, M
Hori, M
Goto, T
Hayashi, Y
Sakamoto, Y
机构
[1] IRIE KOKEN CO LTD, KAWAGOE, SAITAMA 35011, JAPAN
[2] NICHIMEN ELECT TECHNOL CO LTD, KAWAGOE, SAITAMA 35011, JAPAN
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 1996年 / 35卷 / 12B期
关键词
ECR plasma; permanent magnets; CF2; C4F8; radicals; infrared diode laser absorption spectroscopy;
D O I
10.1143/JJAP.35.6528
中图分类号
O59 [应用物理学];
学科分类号
摘要
Diagnostics of fluorocarbon radicals and fluorine (F) atom species in a size-scaleable large-area permanent magnet electron cyclotron resonance (ECR) etching plasma employing CF4 and C4F8 gases are carried out. Son-intrusive infrared laser diode absorption spectroscopy and actinometric measurement techniques are used in evaluating the performance of the permanent magnet ECR plasma source and in studying the kinetic processes associated with etching plasma chemistry. Successful measurements of the absolute CF and CF2 radical and F atom densities have been achieved. In particular for C4F8 plasma, enhanced CF and CF2 radical densities which afford higher selectivity in the etching of SiO2 on Si are discussed. At a pressure of 0.4 Pa and an input microwave power of 900 W the CF and CF2 radical and F atom densities in C4F8 plasma were 1.7 x 10(13) cm(-3), 6.0 x 10(13) cm(-3) and 1.5 x 10(13) cm(-3), respectively. These results are also discussed in comparison with results fora conventional electromagnet ECR plasma source.
引用
收藏
页码:6528 / 6533
页数:6
相关论文
共 20 条
[1]   DEPOSITION IN DRY-ETCHING GAS PLASMAS [J].
ARAI, S ;
TSUJIMOTO, K ;
TACHI, S .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (6B) :2011-2019
[2]  
BOOTH JP, 1986, J VAC SCI TECHNOL A, V4, P1791
[3]   OPTICAL-EMISSION SPECTROSCOPY OF REACTIVE PLASMAS - A METHOD FOR CORRELATING EMISSION INTENSITIES TO REACTIVE PARTICLE DENSITY [J].
COBURN, JW ;
CHEN, M .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (06) :3134-3136
[4]   ETCHING RESULTS AND COMPARISON OF LOW-PRESSURE ELECTRON-CYCLOTRON RESONANCE AND RADIO-FREQUENCY DISCHARGE SOURCES [J].
COOK, JM ;
IBBOTSON, DE ;
FOO, PD ;
FLAMM, DL .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1990, 8 (03) :1820-1824
[5]   HIGH-RATE AND HIGHLY SELECTIVE SIO2 ETCHING EMPLOYING INDUCTIVELY-COUPLED PLASMA [J].
FUKASAWA, T ;
NAKAMURA, A ;
SHINDO, H ;
HORIIKE, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (4B) :2139-2144
[6]   ROLE OF TRANSIENT METASTABLE HEXAGONAL PHASE IN THE FORMATION OF EXTENDED-CHAIN SINGLE-CRYSTALS OF VINYLIDENE FLUORIDE AND TRIFLUOROETHYLENE COPOLYMERS [J].
HIKOSAKA, M ;
SAKURAI, K ;
OHIGASHI, H ;
KELLER, A .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (1A) :214-219
[7]   Absolute fluorine atom concentrations in RIE and ECR CF4 plasmas measured by actinometry [J].
Jenq, J.-S. ;
Ding, J. ;
Taylor, J.W. ;
Hershkowitz, N. .
Plasma Sources Science and Technology, 1994, 3 (02)
[8]   FLUOROCARBON HIGH-DENSITY PLASMA .5. INFLUENCE OF ASPECT RATIO ON THE ETCH RATE OF SILICON DIOXIDE IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA [J].
JOUBERT, O ;
OEHRLEIN, GS ;
ZHANG, Y .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (03) :658-664
[9]   FLUOROCARBON HIGH-DENSITY PLASMA .6. REACTIVE ION ETCHING LAG MODEL FOR CONTACT HOLE SILICON DIOXIDE ETCHING IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA [J].
JOUBERT, O ;
OEHRLEIN, GS ;
SURENDRA, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (03) :665-670
[10]  
KUBOTA K, 1995, JPN J APPL PHYS, V34, P13