共 20 条
[1]
DEPOSITION IN DRY-ETCHING GAS PLASMAS
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1992, 31 (6B)
:2011-2019
[2]
BOOTH JP, 1986, J VAC SCI TECHNOL A, V4, P1791
[4]
ETCHING RESULTS AND COMPARISON OF LOW-PRESSURE ELECTRON-CYCLOTRON RESONANCE AND RADIO-FREQUENCY DISCHARGE SOURCES
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1990, 8 (03)
:1820-1824
[5]
HIGH-RATE AND HIGHLY SELECTIVE SIO2 ETCHING EMPLOYING INDUCTIVELY-COUPLED PLASMA
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1994, 33 (4B)
:2139-2144
[6]
ROLE OF TRANSIENT METASTABLE HEXAGONAL PHASE IN THE FORMATION OF EXTENDED-CHAIN SINGLE-CRYSTALS OF VINYLIDENE FLUORIDE AND TRIFLUOROETHYLENE COPOLYMERS
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1994, 33 (1A)
:214-219
[8]
FLUOROCARBON HIGH-DENSITY PLASMA .5. INFLUENCE OF ASPECT RATIO ON THE ETCH RATE OF SILICON DIOXIDE IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1994, 12 (03)
:658-664
[9]
FLUOROCARBON HIGH-DENSITY PLASMA .6. REACTIVE ION ETCHING LAG MODEL FOR CONTACT HOLE SILICON DIOXIDE ETCHING IN AN ELECTRON-CYCLOTRON-RESONANCE PLASMA
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1994, 12 (03)
:665-670
[10]
KUBOTA K, 1995, JPN J APPL PHYS, V34, P13