Integrated single and two-phase micro heat sinks under IGBT chips

被引：34

作者：

Gillot, C ^{[1
]}

Meysenc, L

Schaeffer, C

Bricard, A

机构：

[1] Lab Electrotech Grenoble, F-38402 St Martin Dheres, France

[2] Commiss Energy Atom, F-38054 Grenoble, France

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 03期

关键词：

IGBT cooling; microchannel heat sink; single-phase; two-phase;

D O I：

10.1109/6144.796540

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Experiments have been performed to assess the feasibility of single and two-phase micro heat exchangers applied to the cooling of insulated gate bipolar transistor (IGBT) power components. After a brief recall of the principal characteristics of such heat exchangers, prototypes that have been built and tested are described. Then, the experimental measurements are compared to the predictions of the thermal and hydraulic performance with water and the inert fluorocarbon liquid (FC72) as coolant fluids.

引用

页码：384 / 389

页数：6

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