Structural relaxation and nanoindentation response in Zr-Cu-Ti amorphous thin films

被引：73

作者：

Chou, H. S. ^{[1
]}

Huang, J. C. ^{[1
]}

Chang, L. W. ^{[1
]}

Nieh, T. G. ^{[2
]}

机构：

[1] Natl Sun Yat Sen Univ, Ctr Nanosci & Nanotechnol, Dept Mat & Optoelect Sci, Kaohsiung 804, Taiwan

[2] Univ Tennessee, Dept Mat Sci & Engn, Knoxville, TN 37996 USA

来源：

APPLIED PHYSICS LETTERS | 2008年 / 93卷 / 19期

关键词：

copper compounds; glass structure; hardness; indentation; metallic glasses; metallic thin films; micromechanical devices; sputtering; titanium compounds; vitrification; zirconium compounds;

D O I：

10.1063/1.2999592

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Ternary Zr-Cu-Ti system, especial with a high Ti content, is normally difficult to be fully vitrified. In this paper, we demonstrate that cosputtering can produce amorphous Zr-Cu-Ti thin films with an excessive Ti content even as high as 19%. Sub-T-g annealing of the film induces the formation of medium-range-ordered clusters and to raise the nanohardness by 35% to 6.6 GPa. The promising mechanical properties of the sub-T-g annealed Zr52Cu29Ti19 films offer great potential for microelectromechanical system applications.

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页数：3

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