A low temperature surface modification assisted method for bonding plastic substrates

被引：133

作者：

Vlachopoulou, M-E ^{[1
]}

Tserepi, A. ^{[1
]}

Pavli, P. ^{[1
]}

Argitis, P. ^{[1
]}

Sanopoulou, M. ^{[2
]}

Misiakos, K. ^{[1
]}

机构：

[1] NCSR Demokritos, Inst Microelect, Aghia Paraskevi 15310, Greece

[2] NCSR Demokritos, Inst Phys Chem, Aghia Paraskevi 15310, Greece

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2009年 / 19卷 / 01期

关键词：

MICROFLUIDIC DEVICES; FABRICATION; POLY(DIMETHYLSILOXANE);

D O I：

10.1088/0960-1317/19/1/015007

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low cost, low temperature process for sealing microfluidic devices composed of at least one organic polymeric substrate is presented. The process is based on the surface modification of the organic substrate by means of a silane solution, resulting in irreversible bonding. It is a generic method of bonding polymeric/plastic substrates, bare or structured ones, such as poly(methylmethacrylate) (PMMA), polystyrene (PS) or epoxy-type polymers, to Si-containing substrates, such as poly(dimethylsiloxane) (PDMS), Si and glass. In the case that bonding between organic polymer (PMMA, PS, etc) substrates is desired, an intermediate thin PDMS layer is required.

引用

页数：6

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