共 1 条
[1]
SCHIMERT T, 1997, P 1996 INT SPEC C OP, P67
Wafer-level vacuum packaging for MEMS
被引：51
作者：
Gooch, R
Schimert, T
McCardel, W
Ritchey, B
Gilmour, D
Koziarz, W
机构：
[1] Raytheon Syst Co, Dallas, TX 75243 USA
[2] USAF, Res Lab, IFTE, Rome, NY 13441 USA
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
|
1999年
/
17卷
/
04期
关键词：
D O I：
10.1116/1.581763
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ;
080502 ;
摘要：
Vacuum packaging of high performance infrared (IR) MEMS uncooled detectors and arrays, inertial MEMS accelerometers and gyros, and radio frequency (rf) MEMS resonators is a key issue in the technology development path to low cost, high volume MEMS production. Wafer-level vacuum packaging transfers the packaging operation into the wafer fab. It is a product neutral enabling technology for commercialization of MEMS for home, industry, automotive, and environmental monitoring applications. 4 in. wafer-level vacuum packaging has been demonstrated using IR MEMS bolometers and results will be presented in this article. In addition to the wafer-level packaging results, vacuum package reliability results obtained on component-level ceramic vacuum packages will also be presented. (C) 1999 American Vacuum Society. [S0734-2101(99)21204-3].
引用
收藏
页码：2295 / 2299
页数：5
相关论文