A lower-melting point solder alloy for surface mounts

被引：18

作者：

McCormack, MT

Degani, Y

Chen, HS

Gesick, WR

机构：

[1] University of California, Berkeley, CA

[2] AT and T Bell Laboratories, Murray Hill, NJ 07974

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1996年 / 48卷 / 05期

关键词：

D O I：

10.1007/BF03222945

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Significant manufacturing cost reductions can be realized with lower-temperature surface mount processing by increasing yields and using less expensive components and boards. A lower-melting-point solder alloy (nominal composition Sn-41.75Pb-8Bi-0.5Ag) has been developed that enables significant reductions in peak reflow temperatures during surface-mount assembly. The solder alloy is compatible with standard Pb-Sn surface finishes, melts within the temperature range of similar to 166-172 degrees C, and has promising mechanical properties.

引用

页码：54 / 56

页数：3